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EM260
Table 12 lists the specifications for the high-frequency crystal.
Table 12. High-Frequency Crystal Specifications
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Frequency
24
MHz
Duty cycle
Phase noise from 1kHz to 100kHz
40
60
-
%
dBc/Hz
120
Accuracy
Crystal ESR
Crystal ESR
Start-up time to stable clock
Initial, temperature, and aging
Load capacitance of 10pF
Load capacitance of 18pF
- 40
+ 40
100
60
1
ppm
?
?
ms
(max. bias)
Start-up time to stable clock
(optimum bias)
2
ms
Current consumption
Good crystal: 20 ? ESR, 10pF
0.2
0.3
mA
load
Current consumption
Worst-case crystals (60 ? , 18pF
0.5
mA
or 100 ? , 10pF)
Current consumption
At maximum bias
1
mA
4.11.2 Internal RC Oscillator
The EM260 has a low-power, low-frequency RC oscillator that runs all the time. Its nominal frequency is
10kHz.
The RC oscillator has a coarse analog trim control, which is first adjusted to get the frequency as close to
10kHz as possible. This raw clock is used by the chip management block. It is also divided down to 1kHz using
a variable divider to allow software to accurately calibrate it. This calibrated clock is used by the sleep timer.
Timekeeping accuracy depends on temperature fluctuations the chip is exposed to, power supply impedance,
and the calibration interval, but in general it will be better than 150ppm (including crystal error of 40ppm).
Table 13 lists the specifications of the RC oscillator.
Table 13. RC Oscillator Specifications
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Frequency
Analog trim steps
10
1
kHz
kHz
Frequency variation with supply
For a voltage drop from 3.6V to
0.75
1.5
%
3.1V or 2.6V to 2.1V
4.12 Random Number Generator
The EM260 allows for the generation of random numbers by exposing a randomly generated bit from the RX
ADC. Analog noise current is passed through the RX path, sampled by the receive ADC, and stored in a
120-0260-000M Rev 1.1
Page 20
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